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preliminary datasheet 380khz, 2a asynchronous dc-dc buck converter AP3202 mar. 2011 rev. 1. 2 bcd semiconductor manufacturing limited 1 general description the AP3202 is a 380khz fixed frequency, current mode, pwm buck (step-down) dc-dc converter, capable of driving a 2a load with high efficiency, excellent line and load regulation. the device integrates n-channel power mosfet switch with low on-resistance. current mode control provides fast transient response and cycl e-by-cycle current limit. a standard series of indu ctors are available from several different manufacturers optimized for use with the AP3202. this feature greatly simplifies the design of switch-mode power supplies. this ic is available in soic-8 package. features ? input voltage range: 4.75v to 18v ? fixed 380khz frequency ? high efficiency: up to 93% ? output current: 2a ? current mode control ? built-in over current protection ? built-in thermal shutdown function ? built-in uvlo function ? built-in over voltage protection ? built-in soft-start applications ? lcd tv ? set top box ? portable dvd ? digital photo frame figure 1. package type of AP3202 soic-8
preliminary datasheet 380khz, 2a asynchronous dc-dc buck converter AP3202 mar. 2011 rev. 1. 2 bcd semiconductor manufacturing limited 2 pin configuration m package (soic-8) figure 2. pin configuration of AP3202 (top view) pin description pin number pin name function 1 bs bootstrap pin. a bootstrap capacitor is connected between the bs pin and sw pin. the voltage across the bootstrap capacitor drives the internal high-side power mosfet 2 in supply input pin. a capacitor should be connected between the in pin and gnd pin to keep the input voltage constant 3 sw power switch output pin. this pin is connected to the inductor and bootstrap capacitor 4 gnd ground pin 5 fb feedback pin. this pin is connected to an external resistor divider to program the system output voltage. when the fb pin voltage exceeds 20% of the nominal regulation value of 1.222v, the over voltage protection is triggered. when the fb pin voltage is below 0.6v, the oscillator frequency is lowered to realize short circuit protection 6 comp compensation pin. this pin is the output of the transconductance error amplifier and the input to the current comparator. it is used to compensate the control loop. connect a series rc network from this pin to gnd. in some cases, an additional capacitor from this pin to gnd pin is required 7 en control input pin. forcing this pin above 1.5v or set this pin floating enables the ic. forcing this pin below 0.5v shuts down the ic. when the ic is in shutdown mode, all functions are disabled to decrease the supply current below 1 a 8 nc no connection
preliminary datasheet 380khz, 2a asynchronous dc-dc buck converter AP3202 mar. 2011 rev. 1. 2 bcd semiconductor manufacturing limited 3 tr: tape & reel blank: tube functional block diagram s r q q internal bias and regulator oscillator 90k/380k 2 1 5v m1 0. 22 bs in current sense amplifier clk slop comp 7 5 4 3 m2 10 sw gnd error amplifier 6 comp fb 1.222 0.6 short protection comparator en shutdown comparator 0.5/1.5v 1.8v 8 nc pwm comparator internal pull high figure 3. functional block diagram of AP3202 ordering information AP3202 - circuit type package m: soic-8 package temperature range part number marking id packing type AP3202m-g1 3202m-g1 tube soic-8 -40 to 85 c AP3202mtr-g1 3202m-g1 tape & reel bcd semiconductor's pb-free products, as designated with "g1" suffix in the part number, are rohs compliant and green. g1: green
preliminary datasheet 380khz, 2a asynchronous dc-dc buck converter AP3202 mar. 2011 rev. 1. 2 bcd semiconductor manufacturing limited 4 absolute maximum ratings (note 1) parameter symbol value unit in pin voltage v in -0.3 to 20 v en pin voltage v en -0.3 to v in v sw pin voltage v sw 20 v bs pin voltage v bs -0.3 to v sw +6 v fb pin voltage v fb -0.3 to 6 v comp pin voltage v comp -0.3 to 6 v thermal resistance ja 105 oc/w operating junction temperature t j 150 oc storage temperature t stg -65 to 150 oc lead temperature (soldering, 10sec) t lead 260 oc esd (machine model) 200 v esd (human body model) 2000 v note 1: stresses greater than those listed under ?absolute maximum ratings? may cause permanent damage to the device. these are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under ?recommended operating co nditions? is not implied. exposure to ?absolute maximum ratings? for extended periods may affect device reliability. recommended operating conditions parameter symbol min max unit input voltage v in 4.75 18 v maximum output current i out(max) 2 a operating ambient temperature t a -40 85 oc
preliminary datasheet 380khz, 2a asynchronous dc-dc buck converter AP3202 mar. 2011 rev. 1. 2 bcd semiconductor manufacturing limited 5 electrical characteristics v in =v en =12v, v out =3.3v, unless otherwise specified. specifi cation with standard typeface are for t a =25 o c, and those in boldface type apply over the full operating temperature range (t a =-40 o c to 85 o c) parameter symbol conditions min typ max unit input voltage v in 4.75 18 v quiescent current i q v fb =1.4v, v en =2v 1.0 1.5 ma shutdown supply current i shdn v en =0v 1 10 a feedback voltage v fb 1.185 1.222 1.258 v feedback over voltage threshold v fbov 1.48 v feedback scp voltage threshold v fbscp 0.6 v feedback bias current i fb v fb =1v -0.1 0.1 a high-side switch on-resistance (note 2) r dsonh i sw =0.5a 0.22 ? low-side switch on-resistance (note 2) r dsonl i sw =0.05a 10 ? high-side switch leakage current i leakh v in =18v, v en =0v v sw =0v 0.1 10 a high-side switch current limit i limh 2.8 3.8 a low-side switch current limit i liml from drain to source 0.15 a v enh 1.5 en pin threshold v enl 0.5 v en pull-up current i en-ph v en =0v 1.0 a input uvlo threshold v uvlo v in rising 3.5 3.9 4.4 v input uvlo hysteresis v hys 0.3 v oscillator frequency f osc1 380 khz short circuit oscillator frequency f osc2 90 khz maximum duty cycle d max v fb =1.0v 90 % minimum duty cycle d min v fb =1.5v 0 % error amplifier voltage gain (note 3) a ea 400 v/v error amplifier transconductance g ea 700 a/v comp to current sense transconductance g cs 2.4 a/v thermal shutdown (note 3) t otsd 160 oc thermal shutdown hysteresis (note 3) t hys 30 oc soft-start time (note 3) t ss i out =0a 500 s note 2: r dson = sw2 sw1 sw2 sw1 i - i v - v note 3: not tested, guaranteed by design.
preliminary datasheet 380khz, 2a asynchronous dc-dc buck converter AP3202 mar. 2011 rev. 1. 2 bcd semiconductor manufacturing limited 6 0.00.20.40.60.81.01.21.41.61.82.0 0 10 20 30 40 50 60 70 80 90 100 efficiency (%) output current (a) v in =5v v in =12v -40 -20 0 20 40 60 80 100 120 140 125 150 175 200 225 250 275 300 325 350 375 high-side switch on-resistance (m ? ) case temperature ( o c) -60 -40 -20 0 20 40 60 80 100 120 140 1.00 1.05 1.10 1.15 1.20 1.25 1.30 feedback voltage (v) case temperature ( o c) typical performance characteristics t a =25 o c , v in =12v, v out =3.3v, unless otherwise noted. figure 4. efficiency vs. output current figure 5. r dsonh vs. case temperature figure 6. r dsonl vs. case temperature figure 7. feedback voltage vs. case temperature -40 -20 0 20 40 60 80 100 120 140 4 6 8 10 12 14 16 18 20 low-side switch on-resistance ( ? ) case temperature ( o c)
preliminary datasheet 380khz, 2a asynchronous dc-dc buck converter AP3202 mar. 2011 rev. 1. 2 bcd semiconductor manufacturing limited 7 -60 -40 -20 0 20 40 60 80 100 120 140 0.5 0.6 0.7 0.8 0.9 1.0 1.1 1.2 1.3 1.4 1.5 quiescent current (ma) case temperature ( o c) 0.0 0.5 1.0 1.5 2.0 3.00 3.05 3.10 3.15 3.20 3.25 3.30 3.35 3.40 3.45 3.50 output voltage (v) output current (a) typical performance characteristics (continued) t a =25 o c , v in =12v, v out =3.3v, unless otherwise noted. figure 8. quiescent current vs. figure 9. output voltage vs. case temperature output current figure 10. enable turn on characteristic figure 11. enable turn off characteristic (i out =2a, cc mode) (i out =2a, cc mode) time (10ms/div) v sw 10v/div i l 1a/div v out 1v/div v en 2v/div v sw 10v/div i l 1a/div v out 1v/div v en 2v/div time (10ms/div)
preliminary datasheet 380khz, 2a asynchronous dc-dc buck converter AP3202 mar. 2011 rev. 1. 2 bcd semiconductor manufacturing limited 8 typical performance characteristics (continued) t a =25 o c , v in =12v, v out =3.3v, unless otherwise noted. figure 12. enable turn on characteristic figure 13. enable turn off characteristic (i out =2a, resistance load) (i ou t =2a, resistance load) figure 14. short circuit protection figure 15. short circuit recovery (i out =2a) (i out =2a) time (800 s/div) v sw 5v/div v en 2v/div i l 1a/div v out 2v/div v sw 5v/div v en 2v/div i l 1a/div v out 2v/div time (400 s/div) v sw 5v/div i l 1a/div v out 2v/div time (100 s/div) v sw 5v/div i l 1a/div v out 2v/div time (100 s/div)
preliminary datasheet 380khz, 2a asynchronous dc-dc buck converter AP3202 mar. 2011 rev. 1. 2 bcd semiconductor manufacturing limited 9 typical application figure 16. typical application of AP3202
preliminary datasheet 380khz, 2a asynchronous dc-dc buck converter AP3202 mar. 2011 rev. 1. 2 bcd semiconductor manufacturing limited 10 mechanical dimensions soic-8 unit: mm(inch) 0 8 1 5 r 0 . 1 5 0 ( 0 . 0 0 6 ) r0.150(0.006) 1.000(0.039) 0.330(0.013) 0.510(0.020) 1.350(0.053) 1.750(0.069) 0.100(0.004) 0.300(0.012) 0.900(0.035) 0.800(0.031) 0.200(0.008) 3.800(0.150) 4.000(0.157) 7 7 2 0 : 1 d 1.270(0.050) typ 0.190(0.007) 0.250(0.010) 8 d 5.800(0.228) 6.200(0.244) 0.675(0.027) 0.725(0.029) 0.320(0.013) 8 0.450(0.017) 0.800(0.031) 4.700(0.185) 5.100(0.201) note: eject hole, oriented hole and mold mark is optional.
important notice bcd semiconductor manufacturing limited reserves the right to make changes without further not ice to any products or specifi- cations herein. bcd semiconductor manufacturing limited does not as sume any responsibility for us e of any its products for any particular purpose, nor does bcd semiconductor manufacturi ng limited assume any liability aris ing out of the application or use of any its products or circui ts. bcd semiconductor manufacturing limited does not convey any license under its patent rights or other rights nor the rights of others. - wafer fab shanghai sim-bcd semiconductor manufacturing co., ltd. 800 yi shan road, shanghai 200233, china tel: +86-21-6485 1491, fax: +86-21-5450 0008 main site regional sales office shenzhen office shanghai sim-bcd semiconductor manuf acturing co., ltd., shenzhen office unit a room 1203, skyworth bldg., gaoxin ave.1.s., nanshan district, shenzhen, china tel: +86-755-8826 7951 fax: +86-755-8826 7865 taiwan office bcd semiconductor (taiwan) company limited 4f, 298-1, rui guang road, nei-hu district, taipei, taiwan tel: +886-2-2656 2808 fax: +886-2-2656 2806 usa office bcd semiconductor corp. 30920 huntwood ave. hayward, ca 94544, usa tel : +1-510-324-2988 fax: +1-510-324-2788 - headquarters bcd semiconductor manufacturing limited no. 1600, zi xing road, shanghai zizhu sc ience-based industrial park, 200241, china tel: +86-21-24162266, fax: +86-21-24162277 bcd semiconductor manufacturing limited important notice bcd semiconductor manufacturing limited reserves the right to make changes without further not ice to any products or specifi- cations herein. bcd semiconductor manufacturing limited does not as sume any responsibility for us e of any its products for any particular purpose, nor does bcd semiconductor manufacturi ng limited assume any liability aris ing out of the application or use of any its products or circui ts. bcd semiconductor manufacturing limited does not convey any license under its patent rights or other rights nor the rights of others. - wafer fab shanghai sim-bcd semiconductor manufacturing limited 800, yi shan road, shanghai 200233, china tel: +86-21-6485 1491, fax: +86-21-5450 0008 bcd semiconductor manufacturing limited main site regional sales office shenzhen office shanghai sim-bcd semiconductor manuf acturing co., ltd. shenzhen office advanced analog circuits (shanghai) corporation shenzhen office room e, 5f, noble center, no.1006, 3rd fuzhong road, futian district, shenzhen 518026, china tel: +86-755-8826 7951 fax: +86-755-8826 7865 taiwan office bcd semiconductor (taiwan) company limited 4f, 298-1, rui guang road, nei-hu district, taipei, taiwan tel: +886-2-2656 2808 fax: +886-2-2656 2806 usa office bcd semiconductor corporation 30920 huntwood ave. hayward, ca 94544, u.s.a tel : +1-510-324-2988 fax: +1-510-324-2788 - ic design group advanced analog circuits (shanghai) corporation 8f, zone b, 900, yi shan road, shanghai 200233, china tel: +86-21-6495 9539, fax: +86-21-6485 9673 bcd semiconductor manufacturing limited http://www.bcdsemi.com bcd semiconductor manufacturing limited

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